Ratkaistu EU-hankinta

Plasma ALD

VTT Technical Research Centre of Finland Ltd · Uusimaa

Perustiedot

Tarjousten määräaika
ma 19.6.2023 klo 12.00 (päättynyt)
Hankkija
VTT Technical Research Centre of Finland Ltd, Y-tunnus 2647375-4
Toteutuspaikka
Uusimaa (FI1B1)
Espoo
Hankintalaji
Tavarahankinta
Menettely
EU-hankinta
Ilmoituksen tyyppi
Hankintailmoitus
Arvioitu kokonaisarvo
1 600 000 € (alv 0 %)
Pääasiallinen CPV
42900000 Erilaiset yleis- ja erikoiskoneet
Julkaistu
18.5.2023

Ilmoituksen teksti

Alkuperäinen teksti Hilmasta, muuttamattomana
The object of the tender is a 2-chamber Plasma Enhanced Atomic Layer Deposition Cluster with Automatic Wafer Handling (later also “Equipment” and/or "Tool") for coating of 200mm wafer substrates, or substrates that can be placed on such carrier wafers, with different metals, nitrides and oxides with process separation between metals/nitrides and oxides, and wafer handling from chamber-to-chamber and chamber-to-cassette without vacuum breaking. The object of the tender process is described in more detail in the invitation to tender documents.

Erän kuvaus

The object of the tender is a 2-chamber Plasma Enhanced Atomic Layer Deposition Cluster with Automatic Wafer Handling (later also “Equipment” and/or "Tool") for coating of 200mm wafer substrates, or substrates that can be placed on such carrier wafers, with different metals, nitrides and oxides with process separation between metals/nitrides and oxides, and wafer handling from chamber-to-chamber and chamber-to-cassette without vacuum breaking. The tool must comply with technical properties and functionality, performance specifications and acceptance criteria set out in this Annex 1. The tool must also comply with the Cleanroom equipment standard safety and contamination requirements set out in Annex 2. A tender which does not meet one or more of the requirements specified in the annexes 1 and / or 2, may be rejected for failing to comply with the call for tenders. The tool specifications are based on the following parameters or targets: • Deposition uniformity • Deposited film performance characteristics • Substrate handling without errors and wafer loss • Recipe library The pricing of the equipment will consist of the main price for the minimum tool requirements (“total price of the equipment”) and a separate price for the optional parts, features and efforts. The optional parts, features and efforts are not included in the total price of the equipment. The object of the tender process is described in more detail in the invitation to tender documents.

Lisätiedot

Additional information regarding the section II.2.7) above: Agreement shall enter into force on the latest date of signature by the Parties and shall be in force until the Equipment has been delivered and accepted, the user training has been held and agreed payment paid, excluding clauses which legal effects are meant to survive the termination or expiration of the Agreement.

Hankinnan vaiheet

  1. Hankintailmoitustämä ilmoitus

    Tarjouspyyntö julkaistiin, määräaika 19.6.2023 klo 12.00.

  2. Jälki-ilmoitus

    Voittaja: Veeco GmbH.

Lähde: Hilma (hankintailmoitukset.fi)

Ilmoitus 2023-128779

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