Market survey: Stylus profilometer for 200/300 mm wafers for VTT Micronova cleanroom

The object of this information request is a Stylus Profilometer for both 200 mm- and 300 mm wafers. VTT is preparing procurement of a new Stylus profilometer into VTT's microelectronics cleanroom located in Espoo Finland (Micronova center for applied micro and nanotechnology | VTT (vttresearch.com)).   With this market survey, VTT is searching for potential suppliers and equipment available to get additional information on suppliers capable of delivering the equipment described in this information request.    Key features:  The tool must be capable of measuring 200- and 300 mm single side polished (SSP), double side polished (DSP)- and SOI silicon wafers as well as glass and fused silica wafers.  Manual wafer loading and unloading requested.  Tool must be capable of completing a measurement automatically.  Tool must feature software necessary for data acquisition and data analysis. With this information request, VTT inquires your opinion about the following:  Your capability to sell the equipment described above.  Description of the equipment.  Delivery time.  Pricing.    In case you are a supplier of the equipment described in this information request, please send your answer with requested information by e-mail to Antti Tolkki, antti.tolkki@vtt.fi by April 19th 2024.  VTT will make a decision about the possible competitive bidding process after this survey is completed.      This is not a call for tenders, and we are not asking for any offers via this announcement. This prior information notice does not obligate the procurement unit for any actions. All information presented in this prior information notice is preliminary and indicative. This notice is not binding on any kind of solutions or actions. The suppliers are not paid for responding to this request for information. Procurement unit asks the parties on the market to respond to this request for information if the party can provide the above-mentioned system.