AUTOMATIC WAFER GRINDER

The object of the tender was an Automatic Wafer Grinder, capable of thinning Si and SiC, LiNbO3 wafers of 100, 150 and 200mm diameter to varying thicknesses with end-point control, cassette-to-cassette processing, TTV profile control and capability to handle thin wafers 100um thick supported by tape and grind away bonded wafer stacks to within 3 um of a typical interface. The object of the tender process was described in more detail in the invitation to tender documents.

The object of the tender was an Automatic Wafer Grinder (later also “Equipment”), capable of thinning Si and SiC, LiNbO3 wafers of 100, 150 and 200mm diameter to varying thicknesses with end-point control, cassette-to-cassette processing, TTV profile control and capability to handle thin wafers 100um thick supported by tape and grind away bonded wafer stacks to within 3 um of a typical interface. The technical specification of the equipment to be supplied was discussed in more detail in Annex 1. The objective was to find one professional supplier that can guarantee a high standard of quality and who is capable of providing the Automatic Wafer Grinder, installation, and user training in its entirety. VTT Technical Research Centre of Finland Ltd will choose one supplier from among the tenderers.