OXIDATION, SINTERING, AND ANNEALING FURNACES

The object of the procurement was an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end. It will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools. The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab. The object of the tender process was described in more detail in the invitation to tender documents.

The object of the procurement was an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end. It will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools. The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab. The object of the tender process was described in more detail in the invitation to tender documents.