SUB MICRON ACCURAY FLIP CHIP DIE BONDE FOR RESEARCH AND SMALL VOLUME PRODUCTION

The object of the tender process was a manual of semiautomatic flip chip die bonder with high placement accuracy and flexibility to different bonding technologies (later also “Equipment”). Main use is research and low volume bonding. Bonder must be able to handle wide scale of different chip sizes and capability to accurately control bond force. Accuracy should targeted below 1 um and advanced alignment features are key parameters. Besides of normal pad alignment also alignment to features around bonded die are required. Main applications are thermocompression flip chip bonding, soldering BGA components and eutectic AuSn soldering and sealing. Different configurations could be implemented with user changeable modules. The object of the tender process was described in more detail in the invitation to tender documents.

The object of the tender process was a manual of semiautomatic flip chip die bonder with high placement accuracy and flexibility to different bonding technologies (later also “Equipment”). Main use is research and low volume bonding. Bonder must be able to handle wide scale of different chip sizes and capability to accurately control bond force. Accuracy should targeted below 1 um and advanced alignment features are key parameters. Besides of normal pad alignment also alignment to features around bonded die are required. Main applications are thermocompression flip chip bonding, soldering BGA components and eutectic AuSn soldering and sealing. Different configurations could be implemented with user changeable modules.